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  1 - 2 ? 2000 ixys all rights reserved symbol test conditions maximum ratings v dss t j = 25  c to 150  c 150 v v dgr t j = 25  c to 150  c; r gs = 1 m  150 v v gs continuous  20 v v gsm transient  30 v i d25 t c = 25  c (mosfet chip capability) 105 a i d(rms) external lead (current limit) 76 a i dm t c = 25  c, note 1 600 a i ar t c = 25  c 150 a e ar t c = 25  c60mj e as t c = 25  c3j dv/dt i s  i dm , di/dt  100 a/  s, v dd  v dss 5 v/ns t j  150  c, r g = 2  p d t c = 25  c 400 w t j -55 ... +150  c t jm 150  c t stg -55 ... +150  c t l 1.6 mm (0.063 in.) from case for 10 s 300  c v isol 50/60 hz, rms t = 1 min 2500 v~ weight 5g symbol test conditions characteristic values (t j = 25  c, unless otherwise specified) min. typ. max. v dss v gs = 0 v, i d = 3ma 150 v v gs(th) v ds = v gs , i d = 8ma 2.0 4.0 v i gss v gs =  20 v, v ds = 0  100 na i dss v ds = v dss t j = 25  c 100  a v gs = 0 v t j = 125  c2 ma r ds(on) v gs = 10 v, i d = i t 12.5 m  notes 2, 3 single mosfet die 98656 (03/17/00) isoplus 247 tm advanced technical information hiperfet tm power mosfets isoplus247 tm (electrically isolated backside) features ? silicon chip on direct-copper-bond substrate - high power dissipation - isolated mounting surface - 2500v electrical isolation  low drain to tab capacitance(<35pf)  low r ds (on) hdmos tm process  rugged polysilicon gate cell structure  unclamped inductive switching (uis) rated  fast intrinsic rectifier applications  dc-dc converters  battery chargers  switched-mode and resonant-mode power supplies  dc choppers  ac and dc motor and servo controls  amplifiers advantages  easy assembly  space savings  high power density  low collector capacitance to ground (low emi) g = gate d = drain s = source * patent pending ixfr 150n15 v dss = 150 v i d25 = 105 a r ds(on) = 12.5 m  t rr  250 ns e153432 ixys reserves the right to change limits, test conditions, and dimensions.
2 - 2 ? 2000 ixys all rights reserved symbol test conditions characteristic values (t j = 25  c, unless otherwise specified) min. typ. max. g fs v ds = 10 v; i d = i t notes 2, 3 50 75 s c iss 9100 pf c oss v gs = 0 v, v ds = 25 v, f = 1 mhz 2600 pf c rss 1200 pf t d(on) 50 ns t r v gs = 10 v, v ds = 0.5  v dss , i d = i t 60 ns t d(off) r g = 1  (external), notes 2, 3 110 ns t f 45 ns q g(on) 360 nc q gs v gs = 10 v, v ds = 0.5  v dss , i d = i t 65 nc notes 2, 3 q gd 190 nc r thjc 0.3 k/w r thck 0.15 k/w source-drain diode characteristic values (t j = 25  c, unless otherwise specified) symbol test conditions min. typ. max. i s v gs = 0 v 150 a i sm repetitive; note 1 600 a v sd i f = i t , v gs = 0 v, notes 2, 3 1.5 v t rr 250 ns q rm 1.1  c i rm 13 a i f = 50a,-di/dt = 100 a/  s, v r = 100 v ixfr 150n15 note: 1. pulse width limited by t jm 2. pulse test, t  300  s, duty cycle d  2 % 3. i t = 75a isoplus 247 (ixfr) outline dim. millimeter inches min. max. min. max. a 4.83 5.21 .190 .205 a 1 2.29 2.54 .090 .100 a 2 1.91 2.16 .075 .085 b 1.14 1.40 .045 .055 b 1 1.91 2.13 .075 .084 b 2 2.92 3.12 .115 .123 c 0.61 0.80 .024 .031 d 20.80 21.34 .819 .840 e 15.75 16.13 .620 .635 e 5.45 bsc .215 bsc l 19.81 20.32 .780 .800 l1 3.81 4.32 .150 .170 q 5.59 6.20 .220 .244 r 4.32 4.83 .170 .190 s 13.21 13.72 .520 .540 t 15.75 16.26 .620 .640 u 1.65 3.03 .065 .080 1 gate, 2 drain (collector) 3 source (emitter) 4 no connection ixys mosfets and igbts are covered by one or more of the following u.s. patents: 4,835,592 4,881,106 5,017,508 5,049,961 5,187,117 5,486,715 4,850,072 4,931,844 5,034,796 5,063,307 5,237,481 5,381,025


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